Our Vision


Let us


The history of "Solder" dates back to the Bronze Age
when mankind began using metal.
And now it became a technology
that is commonly used in manufacturing.
We, WFC, create "MONOZUKURI Infrastructure"
in the next generation "Mounting Technology".
Innovative products created by WFC's "MONOZUKURI Infrastructure"
will cause a paradigm shift in the world of manufacturing.


Our Technology

IH Reflow


Damageless Mounting Technology onto Low Heat Resistance Materials

With conventional mounting techniques such as solder reflow and ACF, heat resistance is highly required for substrates and devices. For this purpose, it is inevitable to use heat-resistant substrates such as glass with low flexibility and stretchability and expensive polyimide. Our core technology "IH Reflow" is a mounting technology that applies IH (Induction Heating), and enables only parts that need to be mounted instantaneously, without physical stress (non-contact), and without damage. This technology makes it possible to mount electronic components that are not heat-resistant, even on low-heat-resistant substrates such as PET, paper, and cloth that are inexpensive and flexible and stretchable. In addition, the application of this technology can dramatically increase production throughput as an alternative to mounting processes on high heat dissipation boards using conventional lasers and hand soldering.

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IH Spot Reflow

IH (Induction Heating) technology makes it possible to mount parts that require component mounting instantly and without applying physical stress to the substrate.

3D Touch Panel

3D Touch Panel can be applied to new center console infotainment that is not in the conventional flat shape, and touch panels that take advantage of the characteristics of lightweight and hard-to-break resin.

Flexible LED Module

Flexible LED Module technology enables new digital signage by mounting fine LEDs on PET films and papers.



IH Reflow EMS


Contract Manufacturing Service for Electronic Equipment based on IH Reflow

We are developing our original electronic equipment contract manufacturing service (EMS) based on the damage-less component mounting technology “IH Reflow”. This service can be applied for various production outsourcing needs such as new digital signages using flexible LED modules made of film and paper, component mounting on plastic moldings that contribute to weight reduction of automobiles, and mass production of prototype IoT/wearable devices with high design flexibility. In addition, IH Reflow Spot mounting can be used to support spot rework of electronic components.


June 2020

We will exhibit at SID Display Week 2020.
Date: June 9 (Tue)-11 (Thu), 2020
Place: San Francisco Moscone Center

April 2020

We will exhibit at Digital Signage Japan 2020.
Date: April 13 (Mon)-15 (Wed), 2020
Place: Makuhari Messe

January 2020

We will exhibit at nano tech 2020.
Date: January 29 (Wed)-31 (Fri), 2020
Place: Tokyo Big Sight, in the booth of NEDO

January 2020

We will exhibit at JFlex2020.
Date: January 29 (Wed)-31 (Fri), 2020
Place: Tokyo Big Sight

January 2020

We will exhibit at INTERNEPCON JAPAN.
Date: January 15 (Wed)-18 (Sat), 2020
Place: Tokyo Big Sight, in the booth of KODENSHI CORP.

October 2019

We will exhibit at SEMICON Japan.
Date: December 11 (Wed)-13 (Fri), 2019
Place: Tokyo Big Sight

October 2019

We will exhibit at ILS Innovation Leaders Summit 2019.
Date: October 28 (Mon)-October 30 (Wed), 2019
Place: Toranomon Hills

December 2018

The head office registration has been changed.
New Address: C-5 Bldg. 9B, 1-21-5 Kandasugacho, Chiyoda-ku, Tokyo 101-0041 Japan
Phone: +81-3-6875-8528
Former Address: 3-29-8-101 Hiyoshihoncho, Kohoku, Yokohama, Kanagawa 223-0062 Japan

December 2018

We will exhibit at SEMICON Japan.
Date and Time: December 12 (Wed)-14 (Fri), 2018 10:00-17:00
Place: Tokyo Big Sight, East 3 Hall, INNOVATION VILLAGE # 3832 Revance Zone C1

December 2018

We will exhibit at the Highly-functional Film Expo.
Date and Time: December 5 (Wed)- 7 (Fri), 2018 10:00-18:00 (last day until 17:00)
Place: Makuhari Messe 4 Hall 21-2 (Nagase & Co., Ltd.)

October 2018

We have been selected and exhibited at ILS Innovation Leaders Summit 2018 “ILS TOP100 STARTUPS”.
Date and Time: October 22 (Mon), 2018 10:00-18:30
Place: Toranomon Hills, 5th floor Hall A1 “Next Generation Venture Show” A4

October 2018

We will exhibit at Monozukuri Matching Japan 2018 “Monozukuri Pavilion with Kanagawa 2018”.
Date and Time: October 17 (Wed)- 19 (Fri), 2018 10:00 - 17:00
Place: Tokyo Big Sight, East 5 Hall R-09-36

September 2018

Posted in Chemical Industry Daily (September 27, 2018) Venture Exploration Corner

July 2018

Homepage was renewed.

March, 2018

Tokyo Kanda Head Office was opened.

September 2014

USA Silicon Valley (California) Office was opened.



Wonder Future Corporation
【Head Office】
C-5 Bldg. 9B, 1-21-5 Kandasugacho, Chiyoda-ku, Tokyo 101-0041 Japan
【USA Silicon Valley (California) Branch Office】
19925 Stevens Creek Blvd #100, Cupertino, USA

By Train

Ginza Line - Kanda Station No. 6 Exit - 3 minutes by walk
JR - Kanda Station North Exit - 6 minites by walk
JR - Akihabara Station - Denkigai Exit - 5 minites by walk
JR - Ochanomizu Station - 7 minites by walk
Chiyoda Line - Shin-Ochanomizu Station - 6 minutes by walk
Matunouchi Line - Awajicho Station - 5 minites by walk
Toei-Shinjyuku Line - Ogawamachi Station - 4 minites by walk