Our Technology
IH Reflow
Damageless Mounting Technology onto Low Heat Resistance Materials
With conventional mounting techniques such as solder reflow and ACF, heat resistance is highly required for substrates and devices. For this purpose, it is inevitable to use heat-resistant substrates such as glass with low flexibility and stretchability and expensive polyimide. Our core technology "IH Reflow" is a mounting technology that applies IH (Induction Heating), and enables only parts that need to be mounted instantaneously, without physical stress (non-contact), and without damage. This technology makes it possible to mount electronic components that are not heat-resistant, even on low-heat-resistant substrates such as PET, paper, and cloth that are inexpensive and flexible and stretchable. In addition, the application of this technology can dramatically increase production throughput as an alternative to mounting processes on high heat dissipation boards using conventional lasers and hand soldering.
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IH (Induction Heating) technology makes it possible to mount parts that require component mounting instantly and without applying physical stress to the substrate.
3D Touch Panel can be applied to new center console infotainment that is not in the conventional flat shape, and touch panels that take advantage of the characteristics of lightweight and hard-to-break resin.
Flexible LED Module technology enables new digital signage by mounting fine LEDs on PET films and papers.
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