HOME | Wonder Future Corporation | TECHNOLOGY | IH Reflow System

IH Reflow System

WIR Series

IH Reflow System
Simple Desktop Testing Machine with Single Head

 
WNTKG900S/F-28XX
 
 
 
 
 
Body Outline

W650 x D600 x H700mm

Body weight

30kg without a chiller

Heating Range

W4 x L50mm / W10 x L25mm

Induction Heating Power Supply

2.8KW / 3.5KW

Head

S: for mounting F: for FPCB

Work

Fixed

Work Size

1005 chips for mounting

50 x 50mm for FPCB

Minimum Heating Target Size

250μm x 250μm

Heating Control

10-Step Cure


IH Relow System
Automatic Testing Machine with Double Head

 
WWH900SF-28XX
 
 
    
 
 
Body Outline

W650 x D600 x H700mm

Body Weight

200kg without a chiller

Heating Range

W4 x L50mm / W10 x L25mm

Induction Heating Power Supply

2.8KW / 3.5KW

Head

S: for mounting   F: for FPCB

Work

XYZ Movable

Work Size

1005 chips for mounting

50 x 50mm for FPCB

Minimum Heating Target Size

250μm x 250μm

Heating Control

10-Step Cure


IH Reflow System
Testing Machine with Single Head for Repair

 
WR900N-28/35XX  
 
 
 
 
Body Outline

W1000 x D1100 x H1700mm

Body Weight

250kg with a chiller

Heating Range

W4 x L50mm / W10 x L25mm

Induction Heating Power Supply

2.8KW / 3.5KW

Head

A special nozzle mechanism for repairing parts is equipped.

Work

XYZ Movable

Work Size

300 x 400mm

Acceptable Size of Parts

1005 chips

Minimum Heating Target Size

250μm x 250μm

Heating Control

10-Step Cure


Product Specification Comparison

  Simple Desktop Testing Machine with Single Head
WNTKG900S/F-28XX
IH Relow System
Automatic Testing Machine with Double Head
WWH900SF-28XX
IH Reflow System
Testing Machine with Single Head for Repair
WR900N-28/35XX
Body Outline W650 x D600 x H700mm $299 W1000 x D1100 x H1700mm
Body Weight 30kg without a chiller 200kg without a chiller 250kg with a chiller
Heating Range W4 x L50mm / W10 x L25mm W4 x L50mm / W10 x L25mm W4 x L50mm / W10 x L25mm
Induction Heating Power Supply 2.8KW / 3.5KW 2.8KW / 3.5KW 2.8KW / 3.5KW
Head S: for mounting
F: for FPCB
S: for mounting
F: for FPCB
A special nozzle mechanism for repairing parts is equipped.
Work Fixed XYZ Movable XYZ Movable
Work Size 1005 chips for mounting
50 x 50mm for FPCB
1005 chips for mounting
50 x 50mm for FPCB
300 x 400mm
Minimum Heating Target Size 250μm x 250μm 250μm x 250μm 250μm x 250μm
Heating Control 10-Step Cure 10-Step Cure 10-Step Cure